Our Advanced Cooling Products

come in several flavors

 

Products for the Bare Die Level

Ultra-Compact, Best Performance

Our embedded chip cooling products bring the cooling within the die to achieve maximum performance in the smallest size possible.  These foundry-friendly solutions are typically added during chip fabrication, or a later packaging facility.

Embedded solutions eliminate the need for any thermal pastes and metal heat sinks.  They are so small that many don't realize the heat sink is built into the chip substrate. 

With multiple patent-pending technologies, our embedded cooling products are a great match for CPU/GPU/ASIC chips, 3D integrated memory chips, and die-level power amplifiers.

 

Products for the Component Level

Small Size, High Performance

Our component cooling products are designed for use at the component level, providing enhanced cooling in a small form factor.  These products are typically added by OEMs or by system integrators.

Modular component cooling solutions are removable and repairable.  They can be attached to existing packages by solder, gaskets, or adhesives.  In many cases they eliminate the need for thermal pastes, simplifying system assembly.

Our patent-pending component cooling products are a great fit  for customized or commercially-available power amplifiers, power inverters, and laser diodes.

 

Products for the Board Level

Easy Installation, High Performance

Our board-mounted cooling products are designed for easy installation on CPUs, GPUs, and ASICs.  These products attach to standard accessory screw patterns on circuit boards, and are compatible with common liquid cooling infrastructure.

Board-level cooling solutions provide an easy way to enhance the cooling of new or existing processors.  Their compact sizes also free up space within the box or rack.

Our easy-to-install board level cooling products are ideal solutions for data center builders, supercomputer facilities, or DIY desktop enthusiasts.

 

Products for the System Level

Drop-in Replacement Cold Plates

Our system level products are designed to be easy to integrate in your existing system.  Many applications already use a liquid cold plate, also referred to as a chill plate.  These are typically aluminum or copper plates, maybe even with fins or channels inside to improve the cooling.

Drop-in replacement cold plates have that same familiar form factor that you already use.  Plus, we build our patent-pending cooling into each one so you get the best in cooling.

Our drop-in replacement cold plates are ideal solutions for system builders who want an easy replacement.  The best part?  We have fast delivery, even for custom designs!

Customized Solutions and Stock Products

Customized Solutions

Most of our solutions are customized for each customer's application.  We are happy to modify our products to fit your system interfaces, and work with you to quickly and easily deliver the solutions you need.

Even our customized solutions can be delivered quickly, with industry best lead times.  Contact us now to start the conversation about a customized solution.

Stock Products

While most of our solutions end up being customized, we also have a library of standard products that fit many commercially-available components from manufacturers like Qorvo, Wolfspeed, and others.  The list is always growing!

If you're working with an off-the-shelf component, we might have a matching stock solution.  Contact us now and we will check our existing library for you.

Not sure which is best?

Download our product comparison chart; it should help.

Want to speak with Sales?

JETCOOL Technologies Inc

 

Low SWaP cooling solutions for the most power dense electronic chips.

P:  (978)  449 - 4600

F:  (978)  449 - 4605

305 Foster Street; Suite 100
Littleton, Massachusetts  01460

© 2020 by JETCOOL Technologies Inc