JETCOOL’s Next-Generation Cooling Technology is Transforming Inverter Capacity, Efficiency and Reliability

Double the Power Density with a Compact Liquid Cooling System

JETCOOL fills the critical gap in high-power electronics performance by leveraging proprietary microconvective cooling technology to significantly reduce the junction temperature of the integrated circuits (ICs) in power modules. This enables inverters with 2X the current density, ½ the SiC/GaN area and an increased mean time to failure (MTTF). Using JETCOOL, companies take a quantum leap forward to safely run devices harder, increase efficiency and extend device lifetime.

Remove thermally-induced performance constraints for good.

JETCOOL's Cooling Technology Enables:

​​

• 70-100% Increase in Power Output

• 20% Reduction in Junction Temperature

• 10x Higher Heat Transfer

• Increase MTTF of the Semiconductor 

• Utilization of Existing Coolant Loop

• Elimination of TIM and Heat Spreaders